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GIGABYTE X570S AORUS MASTER AM4 AMD X570 SATA 6Gb/s ATX AMD Motherboard

 60,000.00

GIGABYTE X570S AORUS MASTER AM4 AMD X570 SATA 6Gb/s ATX AMD Motherboard

  • AMD X570
  • Supports AMD Ryzen 5000 Series / 4000 G-Series / 3000 Series / 3000 G-Series / 2000 Series / 2000 G-Series Processors
  • Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
  • Direct 14+2 Phases Infineon Digital VRM Solution with 70A Power Stage
  • Advanced Thermal Solution with Fins-Array II, Direct Touch Heatpipe II, M.2 Thermal Guard III and Thermal Backplate
  • Intel WiFi 6E 802.11ax & BT 5.2
  • Blazing Fast Intel 2.5GbE LAN with cFosSpeed
  • SuperSpeed USB 3.2 Gen 2×2 TYPE-C delivers up to 20Gb/s transfer speeds
  • Quad Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Thermal Guards
  • 125dB SNR AMP-UP Audio with High-End ESS SABRE 9118 DAC, ALC1220-VB and WIMA Audio Capacitors
  • RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
  • Smart Fan 6 Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP and Noise Detection
  • Active OC Tuner features Dynamic Change Between P.B.O. and Manual OC Settings

 

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Description

GIGABYTE X570S AORUS MASTER AM4 AMD X570 SATA 6Gb/s ATX AMD Motherboard

GIGABYTE Active OC Tuner

With GIGABYTE’s exclusive Active OC Tuner BIOS function, CPU* can work with AMD P.B.O. for gaming and other light workload applications with the highest CPU boost clock, but when the applications require all CPU cores horsepower, it automatically switches to the Manual OC mode where it can utilize the high frequency for all the CPU cores.

Memory Layout – Daisy Chain Design

With the optimized daisy-chain routing, GIGABYTE X570S motherboards provide a proven speed of up to DDR4-5400+ MHz with high density memory modules*. Optimized daisy-chained routing eliminates the stub effect, pushes the one DIMM per channel in dual channel interleaving mode to hit higher memory frequencies, and provides professional gamers a denser and faster system memory experience.

Direct-Touch Heatpipe II

With an extra large 8mm heatpipe and made by a new manufacturing process which has narrow down the gap between the heatpipe and heatsink. The new Direct-Touch Heatpipe II greatly helps to dissipate the heat on MOSFETs.

M.2 Thermal Guard III

Continuing the advantages of M.2 Thermal Guard II design which using the double-sided thermal pads to elevate the height of M.2 heatsink as increasing surface area to dissipate heats on M.2 SSDs. M.2 Thermal Guard III constructed with 2.6X optimized heat dissipation surface to prevent throttling and bottleneck that high-speed/ large capacity of PCIe 4.0 M.2 SSDs may cause, especially under heavy workload.

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