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Gigabyte X570 AORUS ULTRA AM4 ATX Motherboard

 95,000.00

Gigabyte X570 AORUS ULTRA AM4 ATX Motherboard

  • Support for Ryzen 5000 Series with BIOS UPDATE
  • Supports AMD Ryzen 5000 Series / 3rd Gen Ryzen/2nd Gen Ryzen / 2nd Gen Ryzen with Radeon Vega Graphics/Ryzen with Radeon Vega Graphics Processors
  • Dual Channel ECC / Non-ECC Unbuffered DDR4, 4 DIMMs
  • 12+2 Phases IR Digital VRM Solution with PowIRstage
  • Advanced Thermal Design – Fins-Array Heatsink & Direct Touch Heatpipe
  • Triple Ultra-Fast NVMe PCIe 4.0/3.0 M.2 with Triple Thermal Guards
  • Intel Wi-Fi 6 802.11 ax 2T2R & BT 5
  • ALC1220-VB Enhance 114dB (Rear) / 110dB (Front) SNR in Microphone with WIMA Audio Capacitors
  • Intel Gigabit LAN with cFosSpeed Internet Accelerator Networking
  • RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design
  • Smart Fan 5 – Hybrid Fan Headers with FAN STOP
  • 1 x Front Panel & 1 x Rear USB 3.2 Gen 2 Type-C
  • I/O Shield Armor

Out of stock

Description

Gigabyte X570 AORUS ULTRA AM4 ATX Motherboard

 

GET READY FOR AMD RYZEN™ 3000-SERIES

GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE’s dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet, and the latest standard of WIFI design, to fulfill users’ performance, audio, and data transfer needs. The new, advanced power and thermal design enable users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.

AMD StoreMI Technology

GIGABYTE X570 motherboards maximize your PC’s potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC into a performance-driven system.

Ultimate Power Design

To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.

Advanced Thermal Design

X570 AORUS ULTRA reaches a perfect balance between style and performance by combining the media acclaimed Fins-Array heatsink and Direct Touch Heatpipe, to Heatpipe provide 30% lower MOSFET temperatures for enthusiasts, overclockers, and professional gamers.

Fins-Array Heatsink with Direct Touch Heatpipe and High Thermal Conductivity Pad

X570 AORUS ULTRA uses a Fins-Array Heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. Direct Touch Heatpipe helps transfer heat from MOS fins. By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.

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