SK Hynixone of the largest manufacturers of DRAM and NAND flash memories, has announced that mass production of the memories HBM4 is advancing at a steady pace towards the first shipments during the year 2025.
HBM4: SK Hynix confirms the launch of its memories in 2025
SK Hynix advances in mass production of memories HBM4, which will be vitally important for the data center segment and AI for future hardware products from AMD, Nvidia and Intel.
The company advanced its plans during the press conference «AI Era, SK Hynix Blueprint and Strategy» which was celebrated last May 2. There they revealed that their launch window for the HBM4 memories had been brought forward. Originally, the first shipments of these reports were scheduled for the year 2026, but finally that will happen in the year 2025.
SK Hynix’s HBM4 memories will feature 12-layer DRAM stacking technology. Memories with 16-layer stacking will do so in 2026.
SK Hynix and TSMC They are collaborating and signed a strategic memorandum to work on the base matrix of the HBM reports. The partnership leverages TSMC’s 7nm process technology for both current and future memory components.
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SK Hynix also took the opportunity to use a new 1cnm process technology for its HBM4 memorysurpassing memories HBM3E, which uses 12 stacked layers. In the case of these HBM3E memories, mass production will begin in the third quarter of this year, with a similar plan to use a 16-layer stack with a new technology called MR-RUF.
The new HBM memories will be crucial for the technological future, especially for those artificial intelligence services that need increasingly faster memories. We will keep you informed.
